Investigation into thermo-mechanical reliability of copper trace lines in stacked dies ball grid array packaging
Meng-Kai Shih, Sean Shih, Tse-Wei Liao, Dao-Long Chen, D.S. Liu, David Tarng
Topics & Concepts
Ball grid arrayMaterials sciencePrinted circuit boardTemperature cyclingCopperComposite materialThermalMetallurgySolderingEngineeringElectrical engineeringPhysicsMeteorologyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties