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Investigations into the Development of a Mycelium Biocomposite to Substitute Polystyrene in Packaging Applications

Joyal Jose, K. N. Uvais, T. S. Sreenadh, Ashwin V. Deepak, C.R. Rejeesh

2021Arabian Journal for Science and Engineering45 citationsDOI

Topics & Concepts

BiocompositePolystyreneMaterials scienceThermogravimetric analysisMyceliumFourier transform infrared spectroscopyComposite materialDifferential scanning calorimetryScanning electron microscopeSawdustChemical engineeringPolymerComposite numberPulp and paper industryPhysicsEngineeringBotanyBiologyThermodynamicsPlant and Biological Electrophysiology StudiesSlime Mold and Myxomycetes ResearchLight effects on plants
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