Perhydropolysilazane derived SiON interfacial layer for Cu/epoxy molding compound composite
Leijiao Duo, Zongbo Zhang, Kun Zheng, Dan Wang, Caihong Xu, Yuzheng Xia
Topics & Concepts
Materials scienceEpoxyComposite materialComposite numberDurabilityMicroelectronicsIonic bondingMolding (decorative)AdhesivePolymerCompatibility (geochemistry)Layer (electronics)NanotechnologyIonChemistryOrganic chemistry3D IC and TSV technologiesAdvanced ceramic materials synthesisSynthesis and properties of polymers