Multidimensional Encryption by Chip-Integrated Metasurfaces
Shuai Wan, Kening Qu, Yangyang Shi, Zhe Li, Zhe Li, Zejing Wang, Chenjie Dai, Jiao Tang, Zhongyang Li, Zhongyang Li
Abstract
Facing the challenge of information security in the current era of information technology, optical encryption based on metasurfaces presents a promising solution to this issue. However, most metasurface-based encryption techniques rely on limited decoding keys and struggle to achieve multidimensional complex encryption. It hinders the progress of optical storage capacity and puts encryption security at a disclosing risk. Here, we propose and experimentally demonstrate a multidimensional encryption system based on chip-integrated metasurfaces that successfully incorporates the simultaneous manipulation of three-dimensional optical parameters, including wavelength, direction, and polarization. Hence, up to eight-channel augmented reality (AR) holograms are concealed by near- and far-field fused encryption, which can only be extracted by correctly providing the three-dimensional decoding keys and then vividly exhibit to the authorizer with low crosstalk, high definition, and no zero-order speckle noise. We envision that the miniature chip-integrated metasurface strategy for multidimensional encryption functionalities promises a feasible route toward the encryption capacity and information security enhancement of the anticounterfeiting performance and optically cryptographic storage.