Preparation, dielectric and thermomechanical properties of a novel epoxy resin system cured at room temperature
Zhigang Yuan, Ting Wang, Wanan Cai, Zhongcheng Pan, Jun Wang, Mehdi Derradji, Wenbin Liu
Topics & Concepts
Materials scienceEpoxyGlass transitionDynamic mechanical analysisCuring (chemistry)Thermogravimetric analysisDifferential scanning calorimetryComposite materialFourier transform infrared spectroscopyUltimate tensile strengthScanning electron microscopeDielectricThermal stabilityCyanate esterDiglycidyl etherBisphenol APolymerChemical engineeringPhysicsOptoelectronicsThermodynamicsEngineeringSynthesis and properties of polymersEpoxy Resin Curing ProcessesSilicone and Siloxane Chemistry