Multi-beam ultrafast laser processing of free-standing nanofilms
Yuuki Uesugi, Taito Miwa, Naohiro Kadoguchi, Yuichi Kozawa, Shunichi Sato
Abstract
Abstract In this study, femtosecond laser-based multi-beam interference laser processing on nanofilms with nanometer thicknesses was demonstrated. The resulting multi-hole, two-dimensional lattice pattern reflected a laser interference fringe formed on the surface of the nanofilm, with no breaks or cracks. In anticipation of the actual nanostructure fabrication, additional laser processing was performed to drill additional holes in the spaces between the existing holes, resulting in high-density multi-point hole drilling beyond the interference fringe pitch. Notably, processing materials with thicknesses close to 100 nm or less is difficult even with a state-of-the-art focused-ion-beam system. The presented method, in contrast, allows instantaneous, submicrometer-scale multi-point hole drilling of nanofilms over a large area, opening up a new frontier of nanoengineering. Future applications will include the fabrication of electron phase plates, membrane-based optomechanical devices, microelectromechanical systems, and engineering of atomic layer materials.