Material removal and wear mechanism in abrasive polishing of SiO2/SiC using molecular dynamics
Van-Thuc Nguyen, Te‐Hua Fang
Topics & Concepts
Materials scienceAbrasiveSilicon carbideComposite materialSubstrate (aquarium)Molecular dynamicsMechanism (biology)Layer (electronics)TribologyGeologyEpistemologyPhilosophyComputational chemistryChemistryOceanographyAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchMetal and Thin Film Mechanics