Degradation behaviors of silicone gel encapsulation material with moisture intrusion
Kaixuan Li, Boya Zhang, Ziyue Yang, Xinyu Jiang, Xingwen Li
Topics & Concepts
MoistureMaterials scienceSiliconeIntrusionHumidityComposite materialRelative humidityDegradation (telecommunications)DissolutionChemical engineeringComputer scienceTelecommunicationsGeologyMeteorologyGeochemistryEngineeringPhysicsHigh voltage insulation and dielectric phenomenaSilicon Carbide Semiconductor TechnologiesElectromagnetic Compatibility and Noise Suppression