Characterization of machined surface in semi-conductive SiC wafer subjected to micro-EDM drilling
Hoang-Tien Cao, Jeng-Rong Ho, Pi‐Cheng Tung, Hai-Ping Tsui, Chih-Kuang Lin
Topics & Concepts
Materials scienceWaferElectrical discharge machiningCharacterization (materials science)DrillingElectrical conductorMachiningMetallurgyComposite materialOptoelectronicsMechanical engineeringNanotechnologyEngineeringAdvanced Machining and Optimization TechniquesAdvanced Surface Polishing TechniquesAdvanced machining processes and optimization