Development of the MOSAIX chip for the ALICE ITS3 upgrade

Abstract

Abstract Following the ALICE ITS3 detector development path of wafer-scale monolithic stitched pixel detector prototypes (MOSS & MOST) in the TPSCo. 65 nm CMOS imaging technology, the MOSAIX chip is the prototype of the final full-size and full-functionality ITS3 sensor. MOSAIX has a die size of 26.6 × 1.96 cm 2 with an active area exceeding 93 %. It has 144 sensor tiles which can be powered down individually to compensate for manufacturing defects, where each tile has 69.2k pixels with a 22.8 × 20.8 µm 2 pixel size. This contribution provides an overview of the architectural decisions in MOSAIX, highlighting key lessons from the MOSS and MOST prototypes with a focus on yield enhancement techniques.

Topics & Concepts