Litcius/Paper detail

Simulation of heat conduction and thermal cracking of brittle materials using the particle-based discontinuous deformation analysis

Zediao Chen, Feng Liu, Yilin Ren, Yiming Chen

2022Computers and Geotechnics18 citationsDOI

Topics & Concepts

Thermal conductionMaterials scienceThermal conductivityBrittlenessCrackingParticle (ecology)MechanicsThermal contact conductanceThermalDeformation (meteorology)Heat transferComposite materialThermodynamicsThermal resistancePhysicsGeologyOceanographyNumerical methods in engineeringRock Mechanics and ModelingComposite Material Mechanics
Simulation of heat conduction and thermal cracking of brittle materials using the particle-based discontinuous deformation analysis | Litcius