An insight into dynamic properties of SAC305 lead-free solder under high strain rates and high temperatures
Xu Long, Tianxiong Su, Changheng Lu, Shaobin Wang, Jiaqiang Huang, Chao Chang
Topics & Concepts
Materials scienceSplit-Hopkinson pressure barSolderingStrain rateEutectic systemComposite materialHardening (computing)Strain hardening exponentViscoplasticityMicrostructureScanning electron microscopeMetallurgyConstitutive equationFinite element methodStructural engineeringLayer (electronics)EngineeringHigh-Velocity Impact and Material BehaviorElectronic Packaging and Soldering TechnologiesAdvanced ceramic materials synthesis