Direct-to-chip immersion liquid cooling for high-power vertical-cavity surface-emitting laser (VCSEL)
Jionghao Wang, Chongxian Yuan, Yang Li, Chuanchuan Li, Yongli Wang, Xin Wei
Abstract
The performance of high-power laser diodes (HPLDs) is critically dependent on effective thermal management strategies. This study presents an innovative thermal management technique for high-power Vertical-Cavity Surface-Emitting Laser (VCSEL) through direct-to-chip liquid cooling. The effectiveness of this approach was assessed through comprehensive theoretical simulations and experimental analysis. Results indicate that the immersion cooling system facilitates multidimensional heat dissipation, effectively extracting heat from VCSEL arrays and enhancing both efficiency and power stability. In comparison to traditional TEC cooling, immersion cooling lowers junction thermal resistance and increases the optical output power of VCSELs. This comparative advantage makes immersion cooling a more effective solution for HPLD thermal management.