Application of the Taguchi method to minimize the non-uniformity of copper deposition in electroplating with numerical model

Shun-Hsuan Yu, Chuan-Ping Kao, Chun-Wei Ma, Jen-Kuang Fang, Ping‐Feng Yang, Hou-Chien Chang

2024Journal of the Taiwan Institute of Chemical Engineers11 citationsDOI

Topics & Concepts

ElectroplatingTaguchi methodsCopperDeposition (geology)Materials scienceChemical engineeringComputer scienceBiological systemMetallurgyChemistryNanotechnologyComposite materialEngineeringGeologyBiologyLayer (electronics)PaleontologySedimentElectrodeposition and Electroless CoatingsAdvanced Machining and Optimization TechniquesInjection Molding Process and Properties