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Dependability Assessment of Transfer Length Method to Extract the Metal–Graphene Contact Resistance

F. Driussi, Stefano Venica, Amit Gahoi, Satender Kataria, Max C. Lemme, Pierpaolo Palestri

2020IEEE Transactions on Semiconductor Manufacturing16 citationsDOIOpen Access PDF

Abstract

The measurement of the contact resistance (R <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">C</sub> ) in semiconductor devices relies on the well-established Transfer Length Method (TLM). However, an in-depth investigation on its applicability to characterize the metal-graphene contacts is still missing. In this work, a dependability analysis on the R <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">C</sub> values extracted from several metal-graphene stacks is performed, also devising strategies to limit the large observed statistical errors and to obtain dependable results. In particular, artifacts due to an incorrect application of TLM, e.g., negative resistance values, can be eliminated. Finally, a simulation study is proposed to quantify the contribution to R <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">C</sub> of the so-called junction resistance at the edge of the contact, that some authors in the literature invoke to explain the observed artifacts.

Topics & Concepts

DependabilityGrapheneContact resistanceComputer scienceAlgorithmMaterials scienceNanotechnologyLayer (electronics)Software engineeringGraphene research and applicationsSemiconductor materials and interfacesSemiconductor materials and devices
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