New precision electroforming process for the simultaneous improvement of thickness uniformity and microstructure homogeneity of wafer-scale nanotwinned copper arrays
Xiaofei Zhan, Chunjian Shen, Zengwei Zhu, Di Zhu
Topics & Concepts
ElectroformingHomogeneity (statistics)Materials scienceWaferMicrostructureCathodeOptoelectronicsComposite materialElectrical engineeringComputer scienceLayer (electronics)EngineeringMachine learningElectrodeposition and Electroless CoatingsMicrostructure and mechanical propertiesCopper Interconnects and Reliability