Effect of Wire-Drawing Process Conditions on Secondary Recrystallization Behavior During Annealing in High-Purity Copper Wires
Hyun Park, Sang‐Hyeok Kim, Woojin Lee, Jung-Won Ha, Se‐Jong Kim, Hyo‐Jong Lee
Topics & Concepts
Materials scienceRecrystallization (geology)Annealing (glass)Electron backscatter diffractionCopper wireComposite materialMetallurgyCopperGrain sizeShear (geology)Dynamic recrystallizationMicrostructureHot workingBiologyPaleontologyMicrostructure and mechanical propertiesMetallurgy and Material FormingAluminum Alloy Microstructure Properties