Influence of interfacial configuration on bonding strength and wettability between CuNiTi active filler metal and AlN ceramic
Haifeng Xu, Fanwei Meng, Xuanwei Lei, Jian Yang, Jihua Huang, Shuhai Chen, Yüe Zhao
Topics & Concepts
Materials scienceWettingTinComposite materialCeramicSurface energyCrystal (programming language)Chemical bondIonic bondingMetalMetallurgyIonPhysicsOrganic chemistryQuantum mechanicsComputer scienceProgramming languageChemistryAdvanced ceramic materials synthesisElectronic Packaging and Soldering TechnologiesFerroelectric and Piezoelectric Materials