Thermal management of through-silicon vias and back-end-of-line layers in 3D ICs: A comprehensive review
Hengyou Zhang, Miao Tian, Xiaokun Gu
Topics & Concepts
Back end of lineThree-dimensional integrated circuitSiliconThermal management of electronic devices and systemsMaterials scienceThrough-silicon viaLine (geometry)OptoelectronicsNanotechnologyEngineering physicsIntegrated circuitEngineeringMechanical engineeringLayer (electronics)GeometryMathematics3D IC and TSV technologiesThermal properties of materialsElectronic Packaging and Soldering Technologies