Litcius/Paper detail

Iodide-induced galvanic replacement of nickel film on copper as activator for electroless nickel-phosphorus plating

Qiuping Zhao, Guanqun Hu, Rui Huang, Qiang Li, Xingkai Zhang

2022Materials Letters10 citationsDOI

Topics & Concepts

NickelMaterials scienceGalvanic cellCopperIodideInorganic chemistryPalladiumMetallurgyPlating (geology)Electroless nickel platingMetalCatalysisChemistryElectroplatingLayer (electronics)Composite materialElectroless platingBiochemistryGeophysicsGeologyAdvanced Memory and Neural ComputingElectrodeposition and Electroless CoatingsConducting polymers and applications