Finite element method modeling of temperature gradient-induced Cu atomic thermomigration in Cu/Sn/Cu micro solder joint
Tianyue Bai, Yuanyuan Qiao, Xudong Wang, Ning Zhao
Topics & Concepts
SolderingIntermetallicMaterials scienceJoint (building)Finite element methodTemperature gradientDiffusionMetallurgyFlux (metallurgy)Steady state (chemistry)CopperComposite materialThermodynamicsChemistryStructural engineeringPhysical chemistryAlloyEngineeringPhysicsQuantum mechanicsElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy Properties3D IC and TSV technologies