Effects of pyrazine and its derivatives as inhibitors on copper film chemical-mechanical polishing properties for ruthenium-based copper interconnect
Ni Zhan, Chao He, Xinhuan Niu, Nannan Zhang, Yida Zou, Jianghao Liu, Changxin Dong, Xinjie Li, Jianwei Zhou
Topics & Concepts
Chemical-mechanical planarizationCopperX-ray photoelectron spectroscopyCorrosionMaterials scienceAdsorptionWaferElectrochemistryPolishingRutheniumChemical stateChemical engineeringInorganic chemistryMetallurgyNanotechnologyChemistryPhysical chemistryOrganic chemistryEngineeringElectrodeCatalysisAdvanced Surface Polishing TechniquesIntegrated Circuits and Semiconductor Failure AnalysisSemiconductor materials and devices