Toward reducing no-clean flux spatter during reflow soldering: Investigating the effect of flux type, solder mask, and solder pad design
Petr Veselý, Karel Dušek, Denis Froš
Topics & Concepts
SolderingMaterials scienceFlux (metallurgy)Solder pasteMetallurgyReflow solderingPrinted circuit boardCopperWave solderingComposite materialEngineeringElectrical engineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesMetallurgical Processes and Thermodynamics