A material removal coefficient for diamond wire sawing of silicon
Florian Wallburg, Meinhard Kuna, Michael Budnitzki, Stephan Schoenfelder
Topics & Concepts
Materials scienceDiamondAbrasiveWaferSiliconProcess (computing)Mechanical engineeringComposite materialWork (physics)Engineering physicsMetallurgyNanotechnologyComputer scienceEngineeringOperating systemAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchTunneling and Rock Mechanics