Synergistic size and shape effect of dendritic silver nanostructures for low-temperature sintering of paste as die attach materials

Jilei Fan, Gang Li, Krishnamoorthy Rajavel, Pengli Zhu, Rong Sun, Ching‐Ping Wong

2021Journal of Materials Science Materials in Electronics25 citationsDOI

Topics & Concepts

Materials scienceSinteringComposite materialMicrostructureShear strength (soil)NanostructureInterconnectionAdhesiveNanotechnologyLayer (electronics)Computer networkSoil waterEnvironmental scienceSoil scienceComputer scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesNanomaterials and Printing Technologies