Litcius/Paper detail

Enhancing thermal conduction properties of vertically aligned CNT forests by reducing interfacial thermal resistance using an aluminum interlayer

Kosuke Hayashi, Takayuki Nakano, Y. Inoue

2025Carbon15 citationsDOI

Topics & Concepts

Materials scienceAluminiumThermal conductionThermalThermal resistanceComposite materialMeteorologyPhysicsThermal properties of materialsHeat Transfer and OptimizationAluminum Alloys Composites Properties
Enhancing thermal conduction properties of vertically aligned CNT forests by reducing interfacial thermal resistance using an aluminum interlayer | Litcius