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3D study of convection-radiation heat transfer of electronic chip inside enclosure cooled by heat sink

Hamdy Hassan, N. Y. Abdel Shafey

2020International Journal of Thermal Sciences50 citationsDOI

Topics & Concepts

Nusselt numberHeat transferHeat sinkEnclosureMaterials scienceMechanicsNatural convectionHeat fluxThermal conductionThermal radiationHeat transfer coefficientConvective heat transferConvectionForced convectionThermodynamicsPhysicsComposite materialElectrical engineeringEngineeringTurbulenceReynolds numberHeat Transfer and OptimizationNanofluid Flow and Heat TransferHeat Transfer Mechanisms
3D study of convection-radiation heat transfer of electronic chip inside enclosure cooled by heat sink | Litcius