Recent Advances and Trends in Cu–Cu Hybrid Bonding

John H. Lau

2023IEEE Transactions on Components Packaging and Manufacturing Technology108 citationsDOI

Abstract

In this study, the recent advances and trends in Cu–Cu hybrid bonding will be investigated. Emphasis is placed on the definition, kinds, advantages and disadvantages, challenges (opportunities), and examples of Cu–Cu bumpless hybrid bonding. Also, some recommendations will be provided.

Topics & Concepts

Materials scienceNanotechnologyComputer scienceEngineering physicsEngineering3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdditive Manufacturing and 3D Printing Technologies