Phase-field study of IMC growth in Sn–Cu/Cu solder joints including elastoplastic effects
A. Durga, Patrick Wollants, Nele Moelans
Topics & Concepts
IntermetallicMaterials scienceSolderingEigenstrainAnnealing (glass)MetallurgyComposite materialThermodynamicsAlloyResidual stressPhysicsElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesMetallurgy and Material Forming