Low-temperature rough-surface wafer bonding with aluminum nitride ceramics implemented by capillary and oxidation actions
Shao-Ming Nien, Jian‐Long Ruan, Yang-Kuao Kuo, T. -H. Lee
Topics & Concepts
Materials scienceCeramicSilicon nitrideDirect bondingWafer bondingPolishingAnnealing (glass)NitrideSinteringSurface roughnessThermocompression bondingWaferComposite materialAnodic bondingAluminium nitrideAluminiumNanotechnologyLayer (electronics)Advanced ceramic materials synthesis3D IC and TSV technologiesSemiconductor materials and devices