Scalable monolayer-functionalized nanointerface for thermal conductivity enhancement in copper/diamond composite
Bin Xu, Shih‐Wei Hung, Shiqian Hu, Cheng Shao, Rulei Guo, Junho Choi, Takashi Kodama, Fu‐Rong Chen, Junichiro Shiomi
Topics & Concepts
DiamondThermal conductivityMaterials scienceComposite numberCopperVolume fractionSinteringMonolayerComposite materialNanotechnologyMetallurgyThermal properties of materialsAluminum Alloys Composites PropertiesNumerical methods in engineering