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Modeling and analysis of mesh pattern influences on DBC thermal cycling reliability

Lubin Han, Lin Liang, Dedong Chen, Zihao Zhao, Fang Luo, Yong Kang

2020Microelectronics Reliability12 citationsDOI

Topics & Concepts

dBcPolygon meshTemperature cyclingMaterials scienceDelamination (geology)Reliability (semiconductor)Finite element methodStress (linguistics)ThermalStructural engineeringComposite materialPower (physics)EngineeringComputer scienceOptoelectronicsGeologyPhysicsMeteorologyTectonicsQuantum mechanicsLinguisticsPhilosophyCMOSSubductionComputer graphics (images)PaleontologyElectronic Packaging and Soldering TechnologiesSilicon Carbide Semiconductor TechnologiesMechanical stress and fatigue analysis
Modeling and analysis of mesh pattern influences on DBC thermal cycling reliability | Litcius