Improving mode II fracture toughness of secondary bonded joints using laser patterning of adherends
A. Wagih, Ran Tao, Arief Yudhanto, Gilles Lubineau
Topics & Concepts
Materials scienceComposite materialAdhesiveFracture mechanicsDissipationFracture toughnessToughnessFracture (geology)CrackingLaserLap jointJoint (building)Structural engineeringLayer (electronics)OpticsPhysicsThermodynamicsEngineeringMechanical Behavior of CompositesStructural Analysis of Composite MaterialsElectronic Packaging and Soldering Technologies