Low Melting-Point Alloy–Boron Nitride Nanosheet Composites for Thermal Management
Xin Ge, Jiangyun Zhang, Guoqing Zhang, Weijie Liang, Jinsheng Lu, Jianfang Ge
Abstract
The interface thermal resistance (ITR) of thermal interface materials is discussed in terms of electronic unit heat dissipation. To reduce the ITR of heat-conducting silicone grease (HCSG), low melting-point alloys (LMPAs) are introduced using boron nitride nanosheets (BNNS) via a simple route for thermal management. The results reveal that LMPAs uniformly compound and coat BNNS at the nanometer level. The BNNS narrows the LMPAs’ melting range. After reaching the melting point, the composite powder shows a degree of surface wettability. HCSG’s thermal conductivity, prepared using the above composite powder, reaches 1.8 W/(m·K), and its ITR drops from 13.8 to 0.547 °C·cm2/W. HCSG also has good recycling stability.