Litcius/Paper detail

Removal mechanism and hole quality of SiCp/Al composites by ultrasonic elliptical vibration-assisted helical milling

Ji Liu, Yunguang Zhou, Shiqi Jia, Yize Lu, Lianjie Ma, Ming Li, Guoqiang Yin

2024Ceramics International19 citationsDOI

Topics & Concepts

Materials scienceComposite materialUltrasonic sensorVibrationMechanism (biology)Quality (philosophy)AcousticsPhilosophyPhysicsEpistemologyAdvanced Surface Polishing TechniquesAdvanced Machining and Optimization TechniquesAdvanced machining processes and optimization