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Numerical simulation of slag layer and its distribution on hot surface of copper stave based on ANSYS birth-death element technology

Quan Shi, Jue Tang, Mansheng Chu

2021Journal of Iron and Steel Research International20 citationsDOI

Topics & Concepts

Slag (welding)CopperMaterials scienceMetallurgyCopper slagLayer (electronics)Thermal conductivityComposite materialAluminum Alloy Microstructure PropertiesMetallurgical Processes and ThermodynamicsAluminum Alloys Composites Properties
Numerical simulation of slag layer and its distribution on hot surface of copper stave based on ANSYS birth-death element technology | Litcius