Litcius/Paper detail

Isothermal Aging Effect on Sn-58Bi Solder Interconnect Mechanical Shear Stability

Gihan Dodanduwa Waduge, Greg Baty, Youngwoo Lee, Tae-Kyu Lee

2022Journal of Electronic Materials12 citationsDOI

Topics & Concepts

Materials scienceIsothermal processComposite materialSolderingDuctility (Earth science)Shear (geology)BrittlenessBall grid arrayMetallurgyCreepThermodynamicsPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis