Design, integration and performance analysis of a lid-integral microchannel cooling module for high-power chip
Chuan Chen, Fengze Hou, Rui Ma, Meiying Su, Jun Li, Liqiang Cao
Topics & Concepts
MicrochannelHeat sinkMaterials sciencePressure dropThermal resistanceHeat fluxDeep reactive-ion etchingWaferVolumetric flow rateComputer coolingCoolantThermal greaseMechanical engineeringComposite materialHeat transferMechanicsOptoelectronicsThermal conductivityReactive-ion etchingEtching (microfabrication)Thermal management of electronic devices and systemsEngineeringNanotechnologyPhysicsLayer (electronics)Heat Transfer and OptimizationHeat Transfer MechanismsHeat Transfer and Boiling Studies