In situ disbond detection in adhesive bonded multi-layer metallic joint using time-of-flight variation of guided wave
Menglong Liu, Shuting Chen, Zheng Zheng Wong, Kui Yao, Fangsen Cui
Topics & Concepts
Materials scienceAdhesiveFinite element methodTime domainTransducerAcousticsComposite materialUltrasonic sensorGuided wave testingDelamination (geology)Lap jointLayer (electronics)Structural engineeringComputer scienceEngineeringPaleontologyPhysicsSubductionComputer visionBiologyTectonicsUltrasonics and Acoustic Wave PropagationNon-Destructive Testing TechniquesStructural Health Monitoring Techniques