Influence of Sn grain orientation on mean-time-to-failure equation for microbumps in 3D IC technology
Yifan Yao, Andriy Gusak, Chih Chen, Yingxia Liu, K. N. Tu
Topics & Concepts
Materials scienceOrientation (vector space)Composite materialMetallurgyGeometryMathematicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntegrated Circuits and Semiconductor Failure Analysis