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A prediction model and experimental study on the grinding force of 3D-C/ZrC–SiC composites considering two-dimensional ultrasonic parameters

Yashuai Wang, Bo Xin, Jiangtao Li, Hu Li, Yanjiao Jiang, Lida Zhu

2025Journal of Materials Research and Technology5 citationsDOIOpen Access PDF

Abstract

Two-dimensional ultrasonic vibration-assisted grinding(TDUVAG) has a beneficial effect on the challenging processing characteristics of materials that are highly hard and brittle. Currently, there are still gaps in research regarding the mechanism and characteristics of 3D-C/ZrC-SiC during Two-dimensional ultrasound-assisted grinding. This study established a theoretical equation of grinding force considering the two-dimensional ultrasonic amplitude and processing parameters. Starting from the kinematic analysis of a single abrasive, the change in the contact arc length of a single abrasive after applying two-dimensional ultrasonic was considered. The changes in the effective abrasive particle number and the average undeformed chip thickness were analyzed. The grinding force equations were experimentally verified through single-factor experiments, and the prediction accuracy and error were determined. The results demonstrate that the theoretical equation for the macroscopic grinding force, established by introducing the new process parameter of two-dimensional ultrasonic amplitude, can be effectively applied to predict the two-dimensional ultrasonic-assisted grinding force of 3D-C/ZrC composite materials. The mean forecast error of the normal force is 7.14%, and the mean forecast error of the tangential force is 7.02%. The forecast accuracy reaches over 90%. Applying a two-dimensional ultrasonic signal can reduce the processing force. The processing force is in inverse proportion to spindle speed and ultrasound amplitude, and in direct proportion to feed rate and grinding depth. Fibre direction has an impact on processing force. The force reaches its maximal value on the orthogonal plane, followed by the value on the longitudinal plane, and the value on the transverse plane is the smallest.

Topics & Concepts

Materials scienceUltrasonic sensorGrindingAbrasiveSIGNAL (programming language)InverseComposite materialComposite numberTransverse planeKinematicsSignal processingUltrasoundMechanicsAmplitudeContact forcePlane (geometry)Particle (ecology)AcousticsProcess (computing)Mechanism (biology)Orientation (vector space)Grinding wheelPoint (geometry)Mechanical engineeringInverse problemAdvanced machining processes and optimizationAdvanced Surface Polishing TechniquesAdvanced ceramic materials synthesis