Driving force for enhancing the cold silver sinter joining using time domain-dependent Ag–Au epitaxy and interfacial stress
Seoah Kim, Sungwook Mhin, Dongjin Kim, Dongjin Kim
Topics & Concepts
Materials scienceEpitaxyStress (linguistics)MetallurgyComposite materialLayer (electronics)PhilosophyLinguisticsElectronic Packaging and Soldering TechnologiesCopper Interconnects and ReliabilityAluminum Alloys Composites Properties