Tailoring Three-Dimensional copper framework in polyamide 6 for High-Performance thermal management applications
Xiaotong Wang, Jing Zhou, Shuangqiao Yang
Topics & Concepts
Materials sciencePolyamideComposite materialCopperComposite numberThermal conductivityThermalThermal resistancePolymerNanoparticleNanotechnologyMetallurgyPhysicsMeteorologyThermal properties of materialsComposite Material MechanicsDielectric materials and actuators