Manufacturability and Stress Issues in 3D Silicon Detector Technology at IMB-CNM
D. Quirion, María Manna, S. Hidalgo, G. Pellegrini
Abstract
This paper provides an overview of 3D detectors fabrication technology developed in the clean room of the Microelectronics Institute of Barcelona (IMB-CNM). Emphasis is put on manufacturability, especially on stress and bow issues. Some of the technological solutions proposed at IMB-CNM to improve manufacturability are presented. Results and solutions from other research institutes are also mentioned. Analogy with through-silicon-via technology is drawn. This article aims at giving hints of the technology improvements implemented to upgrade from a R&D process to a mature technology.
Topics & Concepts
Design for manufacturabilityUpgradeMicroelectronicsEngineeringDetectorSiliconManufacturing engineeringComputer scienceSystems engineeringMechanical engineeringElectrical engineeringMaterials scienceOptoelectronicsOperating systemAdvanced MEMS and NEMS TechnologiesAdvanced Surface Polishing Techniques3D IC and TSV technologies