A Fully Integrated, Dual Channel, Flip Chip Packaged 113 GHz Transceiver in 28nm CMOS supporting an 80 Gb/s Wireless Link
Andrew Townley, Nima Baniasadi, Sashank Krishnamurthy, Constantine Sideris, Ali Hajimiri, Elad Alon, Ali M. Niknejad
Abstract
In order to meet the demand for increasingly higher data rate wireless links, broad-bandwidth transceivers that support high-spectral-efficiency modulation schemes are required. In this paper, a mm-wave transceiver IC operating at 113GHz is demonstrated, achieving a single-channel data rate of 80Gb/s. The transceiver achieves a high level of integration, including LO generation circuitry, a bits-to-RF TX DAC, and two transceiver channels for polarization diversity. The chip is flip-chip packaged onto a PCB with two orthogonally polarized antennas.
Topics & Concepts
TransceiverCMOSChipBandwidth (computing)WirelessElectronic engineeringComputer scienceChannel (broadcasting)Spectral efficiencyElectrical engineeringComputer hardwareEngineeringTelecommunicationsRadio Frequency Integrated Circuit DesignMillimeter-Wave Propagation and ModelingAdvancements in PLL and VCO Technologies