Mechanical properties and microstructure of low temperature sintered joints using organic-free silver nanostructured film for die attachment of SiC power electronics
Wengan Wang, Guisheng Zou, Qiang Jia, Hongqiang Zhang, Bin Feng, Zhongyang Deng, Lei Liu
Topics & Concepts
Materials scienceMicrostructureSinteringPorosityComposite materialCeramicShear strength (soil)Deposition (geology)Die (integrated circuit)NanotechnologySedimentSoil waterSoil sciencePaleontologyEnvironmental scienceBiologyAdditive Manufacturing and 3D Printing Technologies3D IC and TSV technologiesElectronic Packaging and Soldering Technologies