Mesoscopic simulation on curing deformation and residual stresses of 3D braided composites
Yutong Fu, Xuhao Gao, Xuefeng Yao
Topics & Concepts
Materials scienceCuring (chemistry)Composite materialMesoscopic physicsViscoelasticityResidual stressRepresentative elementary volumeResidualMicrostructureComputer scienceQuantum mechanicsAlgorithmPhysicsEpoxy Resin Curing ProcessesMechanical Behavior of CompositesInjection Molding Process and Properties