Enhanced adhesion strength of copper deposited epoxy composite films for chip substrates by tuning copper oxide and internal stress
Shanjun Ding, Xiao‐Meng Wu, Chuan Chen, Mengqi Gui, Peng Sun, Fang Yang, Xu Zhang, Zhidan Fang, Qidong Wang
Topics & Concepts
CopperEpoxyComposite materialMaterials scienceAdhesionComposite numberInternal stressOxideStress (linguistics)MetallurgyPhilosophyLinguisticsZnO doping and propertiesCopper Interconnects and ReliabilityCopper-based nanomaterials and applications