The material removal and surface generation mechanism in ultra-precision grinding of silicon wafers
Hongfei Tao, Yuanhang Liu, Dewen Zhao, Xinchun Lu
Topics & Concepts
WaferMaterials scienceGroove (engineering)GrindingSurface roughnessMechanical engineeringComposite materialMetallurgyOptoelectronicsEngineeringAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationAdvanced Measurement and Metrology Techniques