Finite element analysis of moisture induced thermo-mechanical delamination of semiconductor packages considering in-situ moisture desorption during reflow process
Yeon-Taek Hwang, Hui-Jin Um, Myeong-Hyeon Yu, Daewoong Lee, Mi-Jung Lee, Hak‐Sung Kim
Topics & Concepts
Materials scienceDelamination (geology)MoistureComposite materialFinite element methodMolding (decorative)Reflow solderingDesorptionSubstrate (aquarium)SolderingStructural engineeringAdsorptionEngineeringTectonicsOceanographyPaleontologyGeologySubductionOrganic chemistryBiologyChemistryElectronic Packaging and Soldering TechnologiesMaterial Properties and ProcessingMechanical Behavior of Composites